8th DAY [WEEK4]

16 JULY 2012 [Monday]

9.00 a.m. – 10.00 a.m.

à Update blog

10.00 a.m. – 1.00 p.m.

à Continue with design circuit using Proteus. A already almost complete design the circuit but after check with Mr. Mazran, there are still have a few components such as diode. For diode and LED, we need to change it to use a connector as ask by Mr.Mazran. All diode and LED are change to connector expert diode zener we still use through hole component.

1 p.m. – 2.00 p.m.

à Break

2.00 p.m. – 5.00 p.m.

à continue design circuit using Proteus Software.

7th DAY [WEEK3]

13 July 2012 [Friday]

9.00 a.m. – 10.00 p.m

à Update blog for yesterday task.

10.00 a.m. – 1.00 p.m.

à Continue study and design circuit using Proteus. Mr. Mazran ask us to change most of the component from the though hole to SMD component based on what kind of component that have in stack.

1.00 p.m. – 2.00 p.m

à Break.

2.00 a.m. – 5.00 p.m.

à Continue with Proteus task.

6th DAY [WEEK3]

12 July 2012 [Thursday]

9.00 a.m. – 10.00 p.m

à Update blog

10.00 a.m. – 5.00 p.m.

à Continue the yesterday work. We are still trying to learn and get familiar with this software.

5th DAY [WEEK3]

11 July 2012 [Wednesday]

9.00 a.m. – 10.00 p.m

à Update blog

10.00 a.m. – 1.00 p.m.

à Today my task is study about Proteus Software. We were divided into a few group and for my group of three person.

à Protues software used to design our circuit and transferred to PCB board before itching and soldering process. We were given two schematic diagram, as our task to construct the circuit.

1.00 p.m. – 2.00 p.m

à Break.

2.00 a.m. – 5.00 p.m.

à Continue study circuit.

4th DAY [WEEK3]

10 July 2012 [Tuesday]

9.00 a.m. – 10.00 p.m

à Update my blog for yesterday work.

10.00 a.m. – 1.00 p.m.

àToday my task is inspection and testing on PCB that I soldered.

à After confirm with Mr. Mazran about my PCB and that I have soldered, the next process is testing process. There are two types of test such as using vibration sensor and using LCD display.

Using VIBRATE SENSOR

1. Connect PCB with power supply, attached IC to the IC port and connect circuit with vibrate sensor.

2. As a result, after power supply were connect to circuit, LED supply will turn ON.

3.  After we shake the vibrate sensor, the LED will turn ON at the same time.

 CONNECT WITH VIBRATE SENSOR

RESULT: LED "ON"

USING LCD DISPLAY

1. After LED display were connected to the board, it will appear the sentences “HELLO WORLD” based on what have m friend set on the coding in PLC programming.

2. My friend have set the IC with both functioning vibrate and LCD display.

 CONNECT WITH LCD DISPLAY 

RESULT: LCD "HELLO WORLD"

1.00 p.m. – 2.00 p.m

à Break.

2.00 a.m. – 5.00 p.m.

à After break, Mr. Mazran givu us a task to study and understanding about AT Command. The instruction can be find in cytron.com.my. This page are about the using GSM Modem to control and monitor via SMS where this modem can be used to send and receive SMS with handphone.

STEP OPEN THE AT COMMAND

Cytron.com.my à GSM Modem à Manual à AT Command

3rd DAY [WEEK3]

09 July 2012 [Monday]

9.00 a.m. – 10.00 p.m

à Update my blog.

10.00 a.m. – 1.00 p.m.

à Continue soldering process with solder through hole component.

Technique solders THROUGH-HOLE COMPONENT.

1. Prepare all components that we need to use for solder. We need to clean component lead and make sure it’s clean from dirt and swear.

2. Insert the component and clinch lead.

3.  Apply flux to soldering point. The purpose of applying flux is to remove oxide layer from the base metal surface, to shield base metal surface from oxygen which re-oxidimetal and to lower solder surface tension to improve wetting.

4. Before soldering, we need to make sure that we are using only well-heated soldering iron. Clean soldering iron tip and the apply a bit solder to iron tip. We need to ensure that solder are attached to tip.

5. In order to solder the point, we need to heat the soldering point and soldering iron must contact both component lead and PCB copper.

6. The apply solder leads and ensure that solder leads must contact both component lead and PCB copper.

After complete solder

TOP VIEW

BOTTOM VIEW

1.00 p.m. – 2.00 p.m

à Break.

2.00 a.m. – 4.00 p.m.

à Continue soldering process.

4.00 p.m. – 5.00 p.m

à After complete soldering process, I have try to test the functionality of my circuit. But unfortunately my circuit did not function. So I have to troubleshoot my circuit. During the troubleshooting process I found a few components with a solder point not contact properly. After re-solder again, I test my circuit and as the result it was function.

2nd DAY [WEEK2]

06 July 2012 [Friday]

8.00 a.m. – 12.00 p.m

à Attend interview at Recron [Malaysia] Sdn. Bhd. company at Kawasan Perindustrian Nilai, Negeri Sembilan. After interview session, I have made a decision to do not accept Recron [M] offer because the department and position that they offered are not related with my courses. I have made a decision to choose UTeM Holding to complete my industrial training.

2.45 p.m. – 5 p.m.

à Come back to self report to UTeM Holding. My task this evening is PCB soldering. We have to solder 28 pin PIC micro controller board. There are two types of soldering that I learned from my friend that is surface mount device (SMD) and through-hole technology.

28 pin PIC micro controller board that I should be solder. 

 

TOP VIEW

BOTTOM VIEW

Technique solders Surface Mount Device [SMD]

1.  Place a small amount of solder on one of two pads. Approximately 0.5mm in height.

2. Grab the resistor with very fine tweezers. Bring the part over top of the pads, slight to one side to that the part can sit flat against the PCB. Heat the pad already with solder and slide the part onto the pad so that it is centered between the pads. Remove heat.

3. Put a small force down on the part and re-heat the one pad to guarantee that the parts is flat against the PCB.

4.  Solder the other side of the part.

After complete solder Surface Mount Device [SMD]

TOP VIEW

 BOTTOM VIEW

1st DAY [WEEK2]

05 JULY 2012

8.30 a.m. – 9.45 a.m.

à Meet with the coordinator, Mr. Fauzi Bin Abd Wahad.

à Discuss about our training status after we have resign from Rangers Communication [M] Sdn. Bhd.

à Mr. Fauzi give us two opinions. For student that already have their own industrial training choices can proceed to report to that company and for those who did no have any places can join industrial training with UTEM Holding

10 a.m. – 12.45 p.m.

à Report to Mr. Mazran and Mr Siva at Hitech Integrated Solutions Innovation Sdn. Bhd [UTeM Holding] is located in FKEKK, UTeM.

à After complete registration process and get a simple briefing from Mr. Mazran, we have been instructed to setup a workplace that we will use as our training room during the training industry. We have chose as a tutorial rooms as our workstation and we have prepared all the equipment such as desks, fans and soldering equipment.

1 p.m.

à We were allowed to go home.