06 July 2012 [Friday]
8.00 a.m. – 12.00 p.m
à Attend interview at Recron [Malaysia] Sdn.
Bhd. company at Kawasan Perindustrian Nilai, Negeri Sembilan. After interview
session, I have made a decision to do not accept Recron [M] offer because the
department and position that they offered are not related with my courses. I
have made a decision to choose UTeM Holding to complete my industrial training.
2.45 p.m. – 5
p.m.
à Come back to self report to UTeM Holding. My
task this evening is PCB soldering. We have to solder 28 pin PIC micro
controller board. There are two types of soldering that I learned from my
friend that is surface mount device (SMD) and through-hole technology.
28 pin PIC
micro controller board that I should be solder.
TOP VIEW
BOTTOM VIEW
Technique
solders Surface Mount Device [SMD]
1. Place a
small amount of solder on one of two pads. Approximately 0.5mm in height.
2. Grab the
resistor with very fine tweezers. Bring the part over top of the pads, slight
to one side to that the part can sit flat against the PCB. Heat the pad already
with solder and slide the part onto the pad so that it is centered between the
pads. Remove heat.
3. Put a small
force down on the part and re-heat the one pad to guarantee that the parts is
flat against the PCB.
4. Solder the
other side of the part.
After
complete solder Surface Mount Device [SMD]
TOP VIEW
BOTTOM VIEW
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