3rd DAY [WEEK3]

09 July 2012 [Monday]

9.00 a.m. – 10.00 p.m

à Update my blog.

10.00 a.m. – 1.00 p.m.

à Continue soldering process with solder through hole component.

Technique solders THROUGH-HOLE COMPONENT.

1. Prepare all components that we need to use for solder. We need to clean component lead and make sure it’s clean from dirt and swear.

2. Insert the component and clinch lead.

3.  Apply flux to soldering point. The purpose of applying flux is to remove oxide layer from the base metal surface, to shield base metal surface from oxygen which re-oxidimetal and to lower solder surface tension to improve wetting.

4. Before soldering, we need to make sure that we are using only well-heated soldering iron. Clean soldering iron tip and the apply a bit solder to iron tip. We need to ensure that solder are attached to tip.

5. In order to solder the point, we need to heat the soldering point and soldering iron must contact both component lead and PCB copper.

6. The apply solder leads and ensure that solder leads must contact both component lead and PCB copper.

After complete solder

TOP VIEW

BOTTOM VIEW

1.00 p.m. – 2.00 p.m

à Break.

2.00 a.m. – 4.00 p.m.

à Continue soldering process.

4.00 p.m. – 5.00 p.m

à After complete soldering process, I have try to test the functionality of my circuit. But unfortunately my circuit did not function. So I have to troubleshoot my circuit. During the troubleshooting process I found a few components with a solder point not contact properly. After re-solder again, I test my circuit and as the result it was function.